GIGABYTE showcases AI-based performance tuning for AMD Ryzen 9000 X3D CPUs at CES 2026
At CES 2026, GIGABYTE highlighted its latest motherboard technologies designed to get more out of AMD’s Ryzen 9000 Series processors featuring 3D V-Cache. The company introduced X3D Turbo Mode 2.0, an AI-driven performance tuning feature that dynamically adjusts system settings based on real-time workloads.
Unlike traditional preset-based tuning, X3D Turbo Mode 2.0 uses a combination of firmware and software to optimize performance automatically. It is designed specifically for Ryzen 9000 X3D processors and is available from launch, removing the need for manual overclocking or complex configuration.
One of the key products demonstrated was the X870E AORUS XTREME X3D AI TOP motherboard. Aimed at enthusiasts and power users, it supports DDR5 memory speeds of up to 9000+ MT/s. GIGABYTE has also focused heavily on cooling, introducing features such as a redesigned thermal layout for the CPU and power delivery components, improved airflow over memory modules, and enhanced heat dissipation for SSDs to maintain performance during extended workloads.
Beyond high-end hardware, GIGABYTE also showcased new motherboard designs targeting PC builders and creators. The X870E AERO X3D WOOD stands out with a wood-grain finish and subtle design accents, offering an alternative to the typical all-metal look seen in most PC components.
The company also expanded its PROJECT STEALTH lineup with new X870 and B850 AORUS STEALTH motherboards. These models use reverse-mounted connectors to keep cables hidden behind the motherboard tray, resulting in cleaner-looking builds and simpler cable management.
GIGABYTE’s CES 2026 announcements reflect a
broader focus on smarter performance tuning, improved thermal design, and
greater attention to aesthetics and ease of assembly, alongside support for
AMD’s latest desktop processors.
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